When Finland’s Donut Lab claimed earlier this year that it had developed a solid-state battery capable of storing 400 ...

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Through-silicon vias are the biggest enabler of 3D chip stacking and chip-to-PCB connections through silicon interposers. The AI boom is causing HBM and advanced assembly shortages, straining the ...

Engineering considerations in multi-chiplet designs.

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Achieving a deterministic “yes or no” answer in semiconductor verification is becoming more challenging as chip complexity increases. There are more cores, more potential interactions, and more ...

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.